Since wafer thickness are getting thinner and thinner, it is a challenge for packaging manufacturer to control their dicing process. When micro cracks and backside chipping happen during the die saw process. It is hardly to see by visible lighting. YAYATECH developed an advance system for micro crack and back side inspection after wafer die saw process. Fully auto inspection can provide higher capacity and avoid human misjudgment. Be able to inspection with blue tape before pick & place process to reduce cost. Wafer mapping and report function can provide statistic information for quality control.


  • Back side chpping inspection
  • Granum table
  • Support 8” & 12” wafer
  • High resolution IR microscope
  • Auto load/unload system
  • Auto mapping and auto judgment software